Education Background
September 2005 - July 2009: Xin’zhou Normal University, Bachelor of Science in Physics
September 2009 - July 2012: Xi'an Technological University, Master of Science in Optics
September 2018 - July 2025: Southeast University, Doctor of Engineering in Electronic Information
Work Experience
2012.08-2020.4 Hengtong Group Processor, R&D Engineer, Chief Engineer, Technical Director
2020.05-2021.08 Huayu Optoelectronics Technology Co., Ltd. Deputy General Manager
2021.09-2024.11 Shanghai Turing Intelligent Computing Quantum Technology Co., Ltd. R&D engineer,project manager
2024.12 to present Micius Laboratory Senior Engineer
Honors and Awards
In 2023, Outstanding Turing Quantum Employees
In 2018, Gusu City has shortage of talents
In 2018 Hengtong Group Skilled Craftsmen
In 2017 Hengtong Light Network Company Skilled Craftsmen
Outstanding employees of Hengtong Light Network Company from 2014 to 2016
In 2014, Wujiang City has shortage of talents
Research grant
1、Major Project of the Ministry of Science and Technology (2010-2012) Physical principles and technical implementation of key devices of all-solid-state quantum information processing, Co-researcher, Finished.
2、China Electronic Components Industry Association (2014-2015) National Optoelectronics and Cable Industry and Optical Devices 13th Five-Year Plan, Principal investigator, Finished.
3、China Electronic Components Industry Association (2017-2018) China Optoelectronics
Device Industry Technology Development Roadmap (2018-2022), Co-researcher, Finished.
4、National Natural Science Foundation of China Large-scale hybrid integrated three-dimensional high-speed optical quantum information processing chip (2022-2024), Co-researcher, Finished.
5、National Natural Science Foundation Characterization and experimental research on the mechanism of dual input/output four-mode optical switch system on ultra-compact silicon substrates (2023-2025), Co-researcher, Finished.
Publications and patents in the past five years
[1] Zhao G, Xiao J et al. Demonstration of a thin-film lithium niobate modulator with integrated bias controllers [J]. IEEE Photonics Technology Letters 7, 1-4(2025).
[2]Zhao G, Xiao J. Low half‐wave‐voltage and high‐bandwidth thin‐film lithium niobate electro‐optic modulator[J]. Journal ofthe Society for Information Display 33, 1-15(2025).
[3] Zhao G, Jinbiao X. High-Bandwidth Thin-Film Lithium Niobate Electro-Optic Modulator with an Low-Loss Edge Face Couplers[C]. 2024 Photonics Global Conference (PGC). (2024).
[4] Zhao G, Jinbiao X. Experimental demonstration of a transceiver with the TFLN modulators [J]. Journal of Circuits, Systems, and Computers 20, 22-32(2024).
[5] Zhao G, Jinbiao X. Low half-wave-voltage and high-bandwidth thin-film lithium niobate electro-optic modulator [C]. 50th European Conference on Optical Communication (ECOC). (2024).
patents
1、Integrated Fixture and Welding Method for Encapsulating Optical Transceiver Module Welding. Authorization Announcement Number: CN108907399B
2、Optical Transceiver Module and Manufacturing Method, Preparation and Coupling Method of Optical Fiber Coupling Device. Authorization Announcement Number: CN114755768B
3、Manufacturing and Testing Method, Device of Active Optical Cable for Optical Transceiver Module and Active Optical Cable. Authorization Announcement Number: CN106371178B
4、A USB Interface Active Optical Cable and Its Manufacturing Device, Manufacturing Method, and Testing Method. Authorization Announcement Number: CN105093441B
5、A Curvilinear Thermally Tunable AWG Arrayed Waveguide Grating Dense Wavelength Division Multiplexer and Its Manufacturing Device, Manufacturing Method, and Testing Method. Authorization Announcement Number: CN103955029B
6、A Multi - aperture Fixture for End - face Grinding of Single Fiber or Chip. Authorization Announcement Number: CN103537980B
7、A Device and Method for Angle Measurement of Optical Fiber Array or Chip. Authorization Announcement Number: CN103105282B